Industry and Military Specified Testing Methods

AUTHORITY

STANDARD

TEST METHOD

TITLE

JEDEC

JESD-22

22-A100-A

Cycled Temperature Humidity Bias Life Test

JEDEC

JESD-22

22-A101-B

Steady State Temperature Humidity Bias Life Test

JEDEC

JESD-22

22-A102-B

Accelerated Moisture Resistance - Unbiased Autoclave

JEDEC

JESD-22

22-A103-A

High Temperature Storage Life

JEDEC

JESD-22

22-A104-A

Temperature Cycling

JEDEC

JESD-22

22-A105-B

Power and Temperature Cycling

JEDEC

JESD-22

22-A106-A

Thermal Shock

JEDEC

JESD-22

22-A107-A

Salt Atmosphere

JEDEC

JESD-22

22-A108-A

Bias Life

JEDEC

JESD-22

22-A109

Hermeticity

JEDEC

JESD-22

22-A110-B

Highly-Accelerated Temperature and Humidity Stress Test (HAST)

JEDEC

JESD-22

22-A112-A

Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices

JEDEC

JESD-22

22-A113-B

Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing

JEDEC

JESD-22

22-A114-A

Electrostatic Discharge (ESD) Sensitivity Testing, Human Body Model (HBM)

JEDEC

JESD-22

22-A115-A

Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM)

JEDEC

JESD-22

22-B100-A

Physical Dimensions

JEDEC

JESD-22

22-B101

External Visual

JEDEC

JESD-22

22-B102-C

Solderability

JEDEC

JESD-22

22-B103-A

Vibration, Variable Frequency

JEDEC

JESD-22

22-B104-A

Mechanical Shock

JEDEC

JESD-22

22-B105-A

Lead Integrity

JEDEC

JESD-22

22-B106-B

Resistance to Soldering Temperature for Through-Hole Mounted Devices

JEDEC

JESD-22

22-B107-A

Marking Permanency

JEDEC

JESD-22

22-B108

Coplanarity Test for Surface-Mount Semiconductor Devices

JEDEC

JESD-22

22-C100-A

High Temperature Continuity

JEDEC

JESD-22

22-C101

Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components

IPC

TM-650

2.1.1D

Microsectioning - 3/98

IPC

TM-650

2.1.1.1

Microsectioning, Ceramic Substrate - 12/87

IPC

TM-650

2.1.1.2

Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate) - 7/93

IPC

TM-650

2.1.2A

Pinhole Evaluation, Dye Penetration Method - 3/76

IPC

TM-650

2.1.3A

Plated-Through Hole Structure Evaluation - 8/76

IPC

TM-650

2.1.5A

Surface Examination, Unclad and Metal Clad Material - 12/82

IPC

TM-650

2.1.6B

Thickness of Glass Fabric - 12/94

IPC

TM-650

2.1.6.1

Weight of Fabric Reinforcements - 12/94

IPC

TM-650

2.1.7C

Thread Count of Glass Fabric - 12/94

IPC

TM-650

2.1.7.1

Thread Count, Organic Fibers - 12/87

IPC

TM-650

2.1.8B

Workmanship - 12/94

IPC

TM-650

2.1.9

Surface Scratch Examination Metal Clad Foil - 5/86

IPC

TM-650

2.1.10A

Visual Inspection for Undissolved Dicyandiamide - 12/94

IPC

TM-650

2.1.13A

Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98

IPC

TM-650

2.2.1A

Mechanical Dimensional Verification - 8/97

IPC

TM-650

2.2.2B

Optical Dimensional Verification - 8/97

IPC

TM-650

2.2.4C

Dimensional Stability, Flexible Dielectric Materials - 5/98

IPC

TM-650

2.2.5A

Dimensional Inspections Using Mircosections - 8/97

IPC

TM-650

2.2.6A

Hole Size Measurement, Drilled - 8/97

IPC

TM-650

2.2.7A

Hole Size Measurement, Plated - 5/86

IPC

TM-650

2.2.8

Location of Holes - 4/73

IPC

TM-650

2.2.10A

Hole Location and Conductor Location - 12/83

IPC

TM-650

2.2.12A

Thickness of Copper by Weight- 3/76

IPC

TM-650

2.2.12.1

Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87

IPC

TM-650

2.2.12.2

Weight and Thickness of Copper Foils with Releasable Carriers - 7/89

IPC

TM-650

2.2.12.3

Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89

IPC

TM-650

2.2.13.1A

Thickness, Plating in Holes, Microhm Method - 1/83

IPC

TM-650

2.2.14

Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95

IPC

TM-650

2.2.14.1

Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95

IPC

TM-650

2.2.14.2

Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95

IPC

TM-650

2.2.14.3

Determination of Maximum Solder Powder Particle Size - 1/95

IPC

TM-650

2.2.15

Cable Dimensions (Flat Cable) - 6/79

IPC

TM-650

2.2.16

Artwork Master Evaluation by Use of a Drilled Panel - 12/87

IPC

TM-650

2.2.16.1

Artwork Master Evaluation by Overlay - 12/87

IPC

TM-650

2.2.17

Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90

IPC

TM-650

2.2.15

Determination of Thickness of Laminates by Mechanical Measurement - 12/94

IPC

TM-650

2.2.15.1

Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94

IPC

TM-650

2.2.19

Measuring Hole Pattern Location-12/87

IPC

TM-650

2.2.19.1

Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94

IPC

TM-650

2.2.20

Solder Paste Metal Content by Weight - 1/95

IPC

TM-650

2.2.21

Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology - 11-98

IPC

TM-650

2.3.1

Chemical Processing, Suitable Processing Material- 4/73

IPC

TM-650

2.3.1.1B

Chemical Cleaning of Metal Clad Laminates- 5/86

IPC

TM-650

2.3.2F

Chemical Resistance Of Flexible Printed Wiring Materials - 5/98

IPC

TM-650

2.3.3A

Chemical Resistance of Insulating Materials- 2/78

IPC

TM-650

2.3.4B

Chemical Resistance, Marking Paints and Inks - 8/97

IPC

TM-650

2.3.4.2A

Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94

IPC

TM-650

2.3.4.3

Chemical Resistance of Core Materials to Methylene Chloride- 5/86

IPC

TM-650

2.3.5B

Density, Insulating Material - 8/97

IPC

TM-650

2.3.6A

Etching, Ammonium Persulfate Method - 7/75

IPC

TM-650

2.3.7A

Etching, Ferric Chloride Method - 7/75

IPC

TM-650

2.3.7.1A

Cupric Chloride Etching Method - 12/94

IPC

TM-650

2.3.7.2A

Alkaline Etching Method - 12/94

IPC

TM-650

2.3.8A

Flammability, Flexible Insulating Materials- 12/82

IPC

TM-650

2.3.8.1

Flammability of Flexible Printed Wiring- 12/88

IPC

TM-650

2.3.9D

Flammability of Prepreg and Thin Laminate - 8/97

IPC

TM-650

2.3.10B

Flammability of Laminate - 12/94

IPC

TM-650

2.3.10.1

Flammability of Soldermask on Printed Wiring Laminate- 8/98

IPC

TM-650

2.3.11

Glass Fabric Construction- 4/73

IPC

TM-650

2.3.13

Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95

IPC

TM-650

2.3.14

Print, Etch, and Plate Test- 4/73

IPC

TM-650

2.3.15C

Purity, Copper Foil or Plating - 8/97

IPC

TM-650

2.3.16B

Resin Content of Prepreg, by Burn-off - 12/94

IPC

TM-650

2.3.16.1C

Resin Content of Prepeg, by Treated Weight--12/94

IPC

TM-650

2.3.16.2

Treated Weight of Prepreg - 12/94

IPC

TM-650

2.3.17D

Resin Flow Percent of Prepreg - 8/97

IPC

TM-650

2.3.17.1B

Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98

IPC

TM-650

2.3.17.2B

Resin Flow of "No Flow" Prepreg - 8/97

IPC

TM-650

2.3.15A

Gel Time, Prepreg Materials - 4/86

IPC

TM-650

2.3.19C

Volatile Content of Prepreg - 12/94

IPC

TM-650

2.3.20

Plating Quality, Hull Cell Method - 8/97

IPC

TM-650

2.3.22

Copper Protective Coating Quality - 2-78

IPC

TM-650

2.3.23B

Cure (Permanency) Thermally Cured Solder Mask - 2/88

IPC

TM-650

2.3.23.1A

Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88

IPC

TM-650

2.3.24

Porosity of Gold Plating- 2/78

IPC

TM-650

2.3.24.1

Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85

IPC

TM-650

2.3.24.2A

Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97

IPC

TM-650

2.3.25B

Detection and Measurement of Ionizable Surface Contaminants - 8/97

IPC

TM-650

2.3.26A

Ionizable Detection of Surface Contaminants (Dynamic Method) - 11/94

IPC

TM-650

2.3.26.1

Ionizable Detection of Surface Contaminants (Static Method) - 11/94

IPC

TM-650

2.3.26.2

Mobile Ion Content of Polymer Films - 7/95

IPC

TM-650

2.3.27

Cleanliness Test - Residual Rosin - 1/95

IPC

TM-650

2.3.27.1

Rosin Flux Residue Analysis-HPLC Method - 1/95

IPC

TM-650

2.3.28

Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95

IPC

TM-650

2.3.29

Flammability, Flexible Flat Cable- 11/88

IPC

TM-650

2.3.30A

Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81

IPC

TM-650

2.3.31

Relative Degree of Cure of U.V. Curable Material - 2/88

IPC

TM-650

2.3.32C

Flux Induced Corrosion (Copper Mirror Method)- 1/95

IPC

TM-650

2.3.33C

Presence of Halides in Flux, Silver Chromate Method - 1/95

IPC

TM-650

2.3.34B

Solids Content, Flux - 1/95

IPC

TM-650

2.3.34.1B

Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95

IPC

TM-650

2.3.35B

Halide Content, Quantitative (Chloride and Bromide)- 1/95

IPC

TM-650

2.3.35.1

Fluorides by Spot Test, Fluxes - Qualitative - 1/95

IPC

TM-650

2.3.35.2

Flouride Concentration, Fluxes - Quantitative--1/95

IPC

TM-650

2.3.36

Acid Acceptance of Chlorinated Solvents- 10/85

IPC

TM-650

2.3.37B

Volatile Content of Adhesive Coated Dielectric Films - 5/98

IPC

TM-650

2.3.38B

Surface Organic Contaminant Detection Test - 8/97

IPC

TM-650

2.3.39B

Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 8/97

IPC

TM-650

2.3.40

Thermal Stability - 7/95

IPC

TM-650

2.4.1D

Adhesion, Tape Testing--8/97

IPC

TM-650

2.4.1.1B

Adhesion, Marking Paints and Inks--11/88

IPC

TM-650

2.4.1.2

Adhesion of Conductors on Hybrid Substrates--12/87

IPC

TM-650

2.4.1.3

Adhesion, Resistors (Hybrid Circuits)--12/87

IPC

TM-650

2.4.1.4

Adhesion, Overglaze (Hybrid Circuits)--12/87

IPC

TM-650

2.4.1.5A

Determination of Heat Transfer--5/95

IPC

TM-650

2.4.1.6

Adhesion, Polymer Coating--7/95

IPC

TM-650

2.4.2A

Ductility of Copper Foil--3/76

IPC

TM-650

2.4.2.1D

Flexural Fatigue and Ductility, Foil--3/91

IPC

TM-650

2.4.3D

Flexural Fatigue, Flexible Printed Wiring Materials--5/98

IPC

TM-650

2.4.3.1C

Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91

IPC

TM-650

2.4.3.2C

Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91

IPC

TM-650

2.4.4B

Flexural Strength of Laminates (at Ambient Temperature)--12/94

IPC

TM-650

2.4.4.1A

Flexural Strength of Laminates (at Elevated Temperature)--12/94

IPC

TM-650

2.4.5

Folding Endurance, Flexible Printed Wiring Materials--4/73

IPC

TM-650

2.4.6

Hot Oil--4/73

IPC

TM-650

2.4.7A

Machinability, Printed Wiring Materials--7/75

IPC

TM-650

2.4.8C

Peel Strength of Metallic Clad Laminates--12/94

IPC

TM-650

2.4.8.1

Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86

IPC

TM-650

2.4.8.2A

Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94

IPC

TM-650

2.4.8.3A

Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94

IPC

TM-650

2.4.8.4

Carrier Release, Thin Copper--1/90

IPC

TM-650

2.4.9D

Peel Strength, Flexible Dielectric Materials--10/88

IPC

TM-650

2.4.9.1

Peel Strength of Flexible Circuits - 11/98

IPC

TM-650

2.4.9.2

Bonding Process - 11/98

IPC

TM-650

2.4.10

Plating Adhesion--4/73

IPC

TM-650

2.4.11

Shear Strength Flexible Dielectric Materials--4/73

IPC

TM-650

2.4.12A

Solderability, Edge Dip Method--6/91

IPC

TM-650

2.4.13F

Solder Float Resistance Flexible Printed Wiring Materials--5/98

IPC

TM-650

2.4.13.1

Thermal Stress of Laminates--12/94

IPC

TM-650

2.4.14

Solderability of Metallic Surfaces--4/73

IPC

TM-650

2.4.14.1

Solderability, Wave Solder Method--3/79

IPC

TM-650

2.4.14.2

Liquid Flux Activity, Wetting Balance Method--1/95

IPC

TM-650

2.4.15A

Surface Finish, Metal Foil--3/76

IPC

TM-650

2.4.16A

Initiation Tear Strength, Flexible Insulating Materials--12/82

IPC

TM-650

2.4.17

Tear Strength, Propagation--4/73

IPC

TM-650

2.4.17.1A

Propagation, Tear Strength, Flexible Insulating Materials--12/82

IPC

TM-650

2.4.15B

Tensile Strength and Elongation, Copper Foil--8/80

IPC

TM-650

2.4.15.1

Tensile Strength and Elongation, In-House Plating--8/97

IPC

TM-650

2.4.15.2

Hot Rupture Strength, Foil--7/89

IPC

TM-650

2.4.15.3

Tensile Strength, Elongation, and Modulus--7/95

IPC

TM-650

2.4.19C

Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98

IPC

TM-650

2.4.20

Terminal Bond Strength, Flexible Printed Wiring--4/73

IPC

TM-650

2.4.21D

Land Bond Strength, Unsupported Component Hole--8/97

IPC

TM-650

2.4.21.1C

Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91

IPC

TM-650

2.4.22C

Bow and Twist (Percentage)--6/99

IPC

TM-650

2.4.22.1C

Bow and Twist-Laminate--5/93

IPC

TM-650

2.4.22.2

Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95

IPC

TM-650

2.4.23

Soldering Resistance of Laminate Materials--3/79

IPC

TM-650

2.4.24C

Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94

IPC

TM-650

2.4.24.1

Time to Delamination (TMA Method)--12/94

IPC

TM-650

2.4.24.2

Glass Transition Temperature of Organic Films - DMA Method--7/95

IPC

TM-650

2.4.24.3

Glass Transition Temperature of Organic Films - TMA Method--7/95

IPC

TM-650

2.4.24.4

Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98

IPC

TM-650

2.4.24.5

Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method -11/98

IPC

TM-650

2.4.25C

Glass Transition Temperature and Cure Factor by DSC--12/94

IPC

TM-650

2.4.26

Tape Test for Additive Printed Boards--3/79

IPC

TM-650

2.4.27.1B

Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95

IPC

TM-650

2.4.27.2A

Solder Mask Abrasion (Pencil Method)--2/88

IPC

TM-650

2.4.28B

Adhesion, Solder Mask (Non-Melting Metals)--8/97

IPC

TM-650

2.4.28.1B

Adhesion, Solder Resist (Mask), Tape Test Method--8/97

IPC

TM-650

2.4.29B

Adhesion, Solder Mask, Flexible Circuit--2/88

IPC

TM-650

2.4.30

Impact Resistance, Polymer Film--10/86

IPC

TM-650

2.4.31A

Folding, Flexible Flat Cable--4/86

IPC

TM-650

2.4.32A

Fold Temperature Testing, Flexible Flat Cable--4/86

IPC

TM-650

2.4.33C

Flexural Fatigue and Ductility, Flat Cable--3/91

IPC

TM-650

2.4.34

Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipose)--1/95

IPC

TM-650

2.4.34.1

Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)--1/95

IPC

TM-650

2.4.34.2

Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)--1/95

IPC

TM-650

2.4.34.3

Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)--1/95

IPC

TM-650

2.4.34.4

Paste Flux Viscosity - T-Bar Spindle Method--1/95

IPC

TM-650

2.4.35

Solder Paste - Slump Test--1/95

IPC

TM-650

2.4.36B

Rework Simulation, Plated-Through Holes for Leaded Components--8/97

IPC

TM-650

2.4.37A

Evaluation of Hand Soldering Tools for Terminal Connections--7/91

IPC

TM-650

2.4.37.1A

Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91

IPC

TM-650

2.4.37.2

Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93

IPC

TM-650

2.4.38A

Prepeg Scaled Flow Testing--6/91

IPC

TM-650

2.4.39A

Dimensional Stability, Glass Reinforced Thin Laminates--2/86

IPC

TM-650

2.4.40

Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87

IPC

TM-650

2.4.41

Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86

IPC

TM-650

2.4.41.1A

Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97

IPC

TM-650

2.4.41.2

Coefficient of Thermal Expansion - Strain Gage Method--8/97

IPC

TM-650

2.4.41.3

In-Plane Coefficient of Thermal Expansion, Organic Films--7/95

IPC

TM-650

2.4.41.4

Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95

IPC

TM-650

2.4.42

Torsional Strength of Chip Adhesives--2/88

IPC

TM-650

2.4.42.1

High Tempreature Mechanical Strength Retention of Adhesives--3/88

IPC

TM-650

2.4.42.2

Die Shear Strength--2/98

IPC

TM-650

2.4.42.3

Wire Bond Pull Strength--2/98

IPC

TM-650

2.4.43

Solder Paste - Solder Ball Test--1/95

IPC

TM-650

2.4.44

Solder Paste - Tack Test--3/98

IPC

TM-650

2.4.45

Solder Paste - Wetting Test--1/95

IPC

TM-650

2.4.46

Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95

IPC

TM-650

2.4.47

Flux Residue Dryness--1/95

IPC

TM-650

2.4.48

Spitting of Flux-Cored Wire Solder--1/95

IPC

TM-650

2.4.49

Solder Pool Test--1/95

IPC

TM-650

2.4.50

Thermal Conductivity, Polymer Films--7/95

IPC

TM-650

2.4.51

Self Shimming Thermally Conductive Adhesives--1/95

IPC

TM-650

2.5.1B

Arc Resistance of Printed Wiring Materials--5/86

IPC

TM-650

2.5.2A

Capacitance of Insulating Materials--7/75

IPC

TM-650

2.5.3B

Current Breakdown, Plated Through Holes--8/97

IPC

TM-650

2.5.4

Current Carrying Capacity, Multilayer Printed Wring--4/73

IPC

TM-650

2.5.4.1A

Conductor Temperature Rise Due to Current Changes in Conductors--8/97

IPC

TM-650

2.5.5A

Dielectric Constant of Printed Wiring Materials--7/75

IPC

TM-650

2.5.5.1B

Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems)--5/86

IPC

TM-650

2.5.5.2A

Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87

IPC

TM-650

2.5.5.3C

Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87

IPC

TM-650

2.5.5.4

Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85

IPC

TM-650

2.5.5.5C

Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98

IPC

TM-650

2.5.5.5.1

Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98

IPC

TM-650

2.5.5.6

Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89

IPC

TM-650

2.5.5.7

Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR--11/92

IPC

TM-650

2.5.5.8

Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95

IPC

TM-650

2.5.5.9

Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98

IPC

TM-650

2.5.6B

Dielectric Breakdown of Rigid Printed Wiring Material--5/86

IPC

TM-650

2.5.6.1A

Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--2/88

IPC

TM-650

2.5.6.2A

Electric Strength of Printed Wiring Material--8/97

IPC

TM-650

2.5.6.3

Dielectric Breakdown Voltage and Dielectric Strength--10/86

IPC

TM-650

2.5.7C

Dielectric Withstanding Voltage, PWB--8/97

IPC

TM-650

2.5.8A

Dissipation Factor of Flexible Printed Wiring Material--7/75

IPC

TM-650

2.5.10A

Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87

IPC

TM-650

2.5.10.1

Insulation Resistivity for Adhesive Interconnection Bonds--11/98

IPC

TM-650

2.5.11

Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73

IPC

TM-650

2.5.12

Interconnection Resistance, Multilayer Printed Wiring--4/73

IPC

TM-650

2.5.13A

Resistance of Copper Foil--3/76

IPC

TM-650

2.5.14A

Resistivity of Copper Foil--8/76

IPC

TM-650

2.5.15A

Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86

IPC

TM-650

2.5.16A

Shorts, Internal on Multilayer Printed Wiring--11/88

IPC

TM-650

2.5.17E

Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98

IPC

TM-650

2.5.17.1A

Volume and Surface Resistivity of Dielectric Materials--12/94

IPC

TM-650

2.5.17.2

Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method--11/98

IPC

TM-650

2.5.15B

Characteristic Impedance Flat Cables (Unbalanced)--7/84

IPC

TM-650

2.5.19A

Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84

IPC

TM-650

2.5.19.1A

Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84

IPC

TM-650

2.5.21A

Digital Unbalanced Crosstalk, Flat Cable--3/84

IPC

TM-650

2.5.24

Conductor Resistance, Flexible Flat Cable--6/79

IPC

TM-650

2.5.25A

Dielectric Withstand Voltage Flexible Fat Cable--11/85

IPC

TM-650

2.5.26A

Insulation Resistance Flexible Flat Cable--11/85

IPC

TM-650

2.5.27

Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79

IPC

TM-650

2.5.28A

Q Resonance, Flexible Printed Wiring Materials--4/88

IPC

TM-650

2.5.30

Balanced and Unbalanced Cable Attenuation Measurements--12/87

IPC

TM-650

2.5.31

Current Leakage (Through Overglaze Films)--12/87

IPC

TM-650

2.5.32

Resistance Test, Plated Through-Holes--12/87

IPC

TM-650

2.5.33

Measurement of Electrical Overstress from Soldering Hand Tools--11/98

IPC

TM-650

2.5.33.1

Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98

IPC

TM-650

2.5.33.2

Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98

IPC

TM-650

2.5.33.3

Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98

IPC

TM-650

2.5.33.4

Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98

IPC

TM-650

2.6.1E

Fungus Resistance Printed Wiring Materials--8/97

IPC

TM-650

2.6.2C

Water Absorption, Flexible Printed Wiring--5/98

IPC

TM-650

2.6.2.1A

Water Absorption, Metal Clad Plastic Laminates--5/86

IPC

TM-650

2.6.3E

Moisture and Insulation Resistance, Printed Boards--8/97

IPC

TM-650

2.6.3.1C

Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98

IPC

TM-650

2.6.3.2B

Moisture and Insulation Resistance, Flexible Base Dielectric--5/88

IPC

TM-650

2.6.3.3A

Surface Insulation Resistance, Fluxes--1/95

IPC

TM-650

2.6.4A

Outgassing, Printed Boards--8/97

IPC

TM-650

2.6.5C

Physical Shock, Multilayer Printed Wiring--8/97

IPC

TM-650

2.6.6B

Temperature Cycling, Printed Wiring Board--12/87

IPC

TM-650

2.6.7A

Thermal Shock and Continuity, Printed Board--8/97

IPC

TM-650

2.6.7.1

Thermal Shock--Polymer Solder Mask Coatings--2/88

IPC

TM-650

2.6.7.2A

Thermal Shock, Continuity and Microsection, Printed Board--8/97

IPC

TM-650

2.6.8D

Thermal Stress, Plated Through-Holes--3/98

IPC

TM-650

2.6.8.1

Thermal Stress, Laminate--9/91

IPC

TM-650

2.6.9A

Vibration, Rigid Printed Wiring--8/97

IPC

TM-650

2.6.9.1

Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy--1/95

IPC

TM-650

2.6.9.2

Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy--1/95

IPC

TM-650

2.6.10A

X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97

IPC

TM-650

2.6.11B

Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88

IPC

TM-650

2.6.12

Temperature Testing, Flexible Flat Cable--6/79

IPC

TM-650

2.6.13

Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring--10/85

IPC

TM-650

2.6.14A

Resistance to Electrochemical Migration, Polymer Solder Mask--8/87

IPC

TM-650

2.6.15B

Corrosion, Flux--1/95

IPC

TM-650

2.6.16

Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85

IPC

TM-650

2.6.16.1

Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vessel)--8/98

IPC

TM-650

2.6.17

Hydrolitic Stability, Flexible Printed Wiring Material--12/82

IPC

TM-650

2.6.15A

Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85

IPC

TM-650

2.6.19

Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards--12/87

IPC

TM-650

2.6.20A

Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage--1/95

IPC

TM-650

2.6.21

Service Temperature of Flexible Printed Wiring--12/88

IPC

TM-650

2.6.22

Superseded by J-STD-035

IPC

TM-650

2.6.23

Test Procedure for Steam Ager Temperature Repeatability--7/93

Defense Dept.

MIL-STD-883E

1001

Barometric pressure, reduced (altitude operation)

Defense Dept.

MIL-STD-883E

1002

Immersion

Defense Dept.

MIL-STD-883E

1003

Insulation resistance

Defense Dept.

MIL-STD-883E

1004.7

Moisture resistance

Defense Dept.

MIL-STD-883E

1005.8

Steady state life

Defense Dept.

MIL-STD-883E

1006

Intermittent life

Defense Dept.

MIL-STD-883E

1007

Agree life

Defense Dept.

MIL-STD-883E

1008.2

Stabilization bake

Defense Dept.

MIL-STD-883E

1009.8

Salt atmosphere (corrosion)

Defense Dept.

MIL-STD-883E

1010.7

Temperature cycling

Defense Dept.

MIL-STD-883E

1011.9

Thermal shock

Defense Dept.

MIL-STD-883E

1012.1

Thermal characteristics

Defense Dept.

MIL-STD-883E

1013

Dew point

Defense Dept.

MIL-STD-883E

1014.1

Seal

Defense Dept.

MIL-STD-883E

1015.9

Burn-in test

Defense Dept.

MIL-STD-883E

1016

Life/reliability characterization tests

Defense Dept.

MIL-STD-883E

1017.2

Neutron irradiation

Defense Dept.

MIL-STD-883E

1015.2

Internal water-vapor content

Defense Dept.

MIL-STD-883E

1019.4

Ionizing radiation (total dose) test procedure

Defense Dept.

MIL-STD-883E

1020.1

Dose rate induced latchup test procedure

Defense Dept.

MIL-STD-883E

1021.2

Dose rate upset testing of digital microcircuits

Defense Dept.

MIL-STD-883E

1022

Mosfet threshold voltage

Defense Dept.

MIL-STD-883E

1023.2

Dose rate response of linear microcircuits

Defense Dept.

MIL-STD-883E

1030.1

Preseal burn-in

Defense Dept.

MIL-STD-883E

1031

Thin film corrosion test

Defense Dept.

MIL-STD-883E

1032.1

Package induced soft error test procedure (due to alpha particles)

Defense Dept.

MIL-STD-883E

1033

Endurance life test

Defense Dept.

MIL-STD-883E

1034

Dye penetrant test (for plastic devices)

Defense Dept.

MIL-STD-883E

2001.2

Constant acceleration

Defense Dept.

MIL-STD-883E

2002.3

Mechanical shock

Defense Dept.

MIL-STD-883E

2003.7

Solderability

Defense Dept.

MIL-STD-883E

2004.5

Lead integrity

Defense Dept.

MIL-STD-883E

2005.2

Vibration fatigue

Defense Dept.

MIL-STD-883E

2006.1

Vibration noise

Defense Dept.

MIL-STD-883E

2007.2

Vibration, variable frequency

Defense Dept.

MIL-STD-883E

2008.1

Visual and mechanical

Defense Dept.

MIL-STD-883E

2009.9

External visual

Defense Dept.

MIL-STD-883E

2010.10

Internal visual (monolithic)

Defense Dept.

MIL-STD-883E

2011.7

Bond strength (destructive bond pull test)

Defense Dept.

MIL-STD-883E

2012.7

Radiography

Defense Dept.

MIL-STD-883E

2013.1

Internal visual inspection for DPA

Defense Dept.

MIL-STD-883E

2014

Internal visual and mechanical

Defense Dept.

MIL-STD-883E

2015.11

Resistance to solvents

Defense Dept.

MIL-STD-883E

2016

Physical dimensions

Defense Dept.

MIL-STD-883E

2017.7

Internal visual (hybrid)

Defense Dept.

MIL-STD-883E

2015.3

Scanning electron microscope (SEM) inspection of metallization

Defense Dept.

MIL-STD-883E

2019.5

Die shear strength

Defense Dept.

MIL-STD-883E

2020.7

Particle impact noise detection test

Defense Dept.

MIL-STD-883E

2021.3

Glassivation layer integrity

Defense Dept.

MIL-STD-883E

2022.2

Wetting balance solderability

Defense Dept.

MIL-STD-883E

2023.5

Nondestructive bond pull

Defense Dept.

MIL-STD-883E

2024.2

Lid torque for glass-frit-sealed packages

Defense Dept.

MIL-STD-883E

2025.4

Adhesion of lead finish

Defense Dept.

MIL-STD-883E

2026

Random vibration

Defense Dept.

MIL-STD-883E

2027.2

Substrate attach strength

Defense Dept.

MIL-STD-883E

2028.4

Pin grid package destructive lead pull test

Defense Dept.

MIL-STD-883E

2029

Ceramic chip carrier bond strength

Defense Dept.

MIL-STD-883E

2030

Ultrasonic inspection of die attach

Defense Dept.

MIL-STD-883E

2031.1

Flip chip pull-off test

Defense Dept.

MIL-STD-883E

2032.1

Visual inspection of passive elements

Defense Dept.

MIL-STD-883E

2035

Ultrasonic inspection of TAB bonds

Defense Dept.

MIL-STD-883E

3001.1

Drive source, dynamic

Defense Dept.

MIL-STD-883E

3002.1

Load conditions

Defense Dept.

MIL-STD-883E

3003.1

Delay measurements

Defense Dept.

MIL-STD-883E

3004.1

Transition time measurements

Defense Dept.

MIL-STD-883E

3005.1

Power supply current

Defense Dept.

MIL-STD-883E

3006.1

High level output voltage

Defense Dept.

MIL-STD-883E

3007.1

Low level output voltage

Defense Dept.

MIL-STD-883E

3008.1

Breakdown voltage, input or output

Defense Dept.

MIL-STD-883E

3009.1

Input current, low level

Defense Dept.

MIL-STD-883E

3010.1

Input current, high level

Defense Dept.

MIL-STD-883E

3011.1

Output short circuit current

Defense Dept.

MIL-STD-883E

3012.1

Terminal capacitance

Defense Dept.

MIL-STD-883E

3013.1

Noise margin measurements for digital microelectronic devices

Defense Dept.

MIL-STD-883E

3014

Functional testing

Defense Dept.

MIL-STD-883E

3015.7

Electrostatic discharge sensitivity classification

Defense Dept.

MIL-STD-883E

3016

Activation time verification

Defense Dept.

MIL-STD-883E

3017

Microelectronics package digital signal transmission

Defense Dept.

MIL-STD-883E

3015

Crosstalk measurements for digital microelectronic device packages

Defense Dept.

MIL-STD-883E

3019.1

Ground and power supply impedance measurements for digital microelectronics device packages

Defense Dept.

MIL-STD-883E

3020

High impedance (off-state) low-level output leakage current

Defense Dept.

MIL-STD-883E

3021

High impedance (off-state) high-level output leakage current

Defense Dept.

MIL-STD-883E

3022

Input clamp voltage

Defense Dept.

MIL-STD-883E

3023

Static latch-up measurements for digital CMOS microelectronic devices

Defense Dept.

MIL-STD-883E

3024

Simultaneous switching noise measurements for digital microelectronic devices

Defense Dept.

MIL-STD-883E

4001.1

Input offset voltage and current and bias current

Defense Dept.

MIL-STD-883E

4002.1

Phase margin and slew rate measurements

Defense Dept.

MIL-STD-883E

4003.1

Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio

Defense Dept.

MIL-STD-883E

4004.1

Open loop performance

Defense Dept.

MIL-STD-883E

4005.1

Output performance

Defense Dept.

MIL-STD-883E

4006.1

Power gain and noise figure

Defense Dept.

MIL-STD-883E

4007

Automatic gain control range

Defense Dept.

MIL-STD-883E

5001

Parameter mean value control

Defense Dept.

MIL-STD-883E

5002.1

Parameter distribution control

Defense Dept.

MIL-STD-883E

5003

Failure analysis procedures for microcircuits

Defense Dept.

MIL-STD-883E

5004.10

Screening procedures

Defense Dept.

MIL-STD-883E

5005.13

Qualification and quality conformance procedures

Defense Dept.

MIL-STD-883E

5006

Limit testing

Defense Dept.

MIL-STD-883E

5007.6

Wafer lot acceptance

Defense Dept.

MIL-STD-883E

5008.8

Test procedures for hybrid and multichip microcircuits

Defense Dept.

MIL-STD-883E

5009.1

Destructive physical analysis

Defense Dept.

MIL-STD-883E

5010.3

Test procedures for custom monolithic microcircuits

Defense Dept.

MIL-STD-883E

5011.4

Evaluation and acceptance procedures for polymeric adhesives.

Defense Dept.

MIL-STD-883E

5012.1

Fault coverage measurement for digital microcircuits.

Defense Dept.

MIL-STD-883E

5013

Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers.